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| (R) STBR606/608 50-60Hz RECTIFICATION BRIDGE MAJOR PRODUCT CHARACTERISTICS + IF(AV) VRRM VF (max) 6A 600 V / 800 V 1.05 V - ~ ~ FEATURES AND BENEFITS Dielectric strength of 2000V High Surge overload rating High Surge current capability UL94V0 Planar technology s s s s s - ~~ + GBU STBR606/608 DESCRIPTION Single-phase 6A Bridge for 50 & 60Hz rectification in Switch Mode Power Supplies. Applications: Home appliances, Automation, Telecommunications, PC, Servers. ABSOLUTE RATINGS (limiting values) Symbol VRRM VRMS VDC IF(AV) IFSM Parameter Repetitive peak reverse voltage RMS Voltage DC Blocking voltage Average Forward Current Non repetitive surge peak forward current Rating for Fusing (tp < 8.3ms) Maximum operating junction temperature Storage temperature range TC = 60C tp = 8.3 ms Single sine wave (JEDEC method) STBR606 STBR608 600 800 420 600 6 175 560 800 Unit V V V A A I2t Tj Tstg 127 150 - 50 to 150 A2S C C August 2001 - Ed: 4D 1/4 STBR606/608 THERMAL PARAMETERS Symbol Rth(j-c) Rth(j-a) Parameter Junction to case Junction to ambient Min. Typ. 7.4 Max. 8 35 Unit C/W C/W ELECTRICAL CHARACTERISTICS Symbol VF IR C Parameter Forward voltage drop Reverse leakage current per leg Junction capacitance per leg Test conditions IF = 6A VR = VRRM (note 1) Tj = 25C Tj = 125C 55 Min. Typ. Max. 1.05 5 50 Unit V A A pF Note 1: Measured at 1MHz and applied reverse voltage of 4V. Fig. 1: Average power dissipation of bridge versus average output current. PF(av)(W) 12 11 10 9 8 7 6 5 4 3 2 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 IP / IF(av)=P (resistive load) IP / IF(av)=20 IP / IF(av)=10 IP / IF(av)=5 (capacitive load) Fig. 2: Average output current versus ambient temperature (resistive load or inductive load) IF(av)(A) 7 Rth(j-a)=Rth(j-c) 6 5 Rth(j-a)=15C/W 4 3 Rth(j-a)=35C/W 2 1 IF(av)(A) 0 0 25 50 Tamb(C) 75 100 125 150 Fig. 3: Variation of thermal impedance junction to ambient versus pulse duration (printed circuit board epoxy FR4) Zth(j-a)(C/W) 100.0 Free air Fig. 4: Forward voltage drop versus forward current (typical values, per leg). IFM(A) 1000.0 100.0 10.0 10.0 Tj=125C Tj=25C 1.0 1.0 tp(s) 0.1 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 VFM(V) 0.1 0.0 0.5 1.0 1.5 2.0 2.5 2/5 STBR606/608 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values, per leg). Fig. 6: Relative leakage current versus junction temperature (typical values). IR(A) 1.E+01 VR=800V IR(A) 1.E+01 Tj=150C 1.E+00 Tj=125C 1.E+00 1.E-01 1.E-01 1.E-02 Tj=75C 1.E-02 1.E-03 1.E-03 1.E-04 1.E-04 Tj=25C VR(V) 1.E-05 0 100 200 300 400 500 600 700 800 Tj(C) 1.E-05 0 25 50 75 100 125 150 Fig. 7: Junction capacitance versus reverse voltage applied (typical values). C(pF) 100 F=1MHz Vosc=30mVRMS Tj=25C Fig. 8: Softness factor versus dIF/dt (typical values). S(Softness factor) 1.6 1.4 1.2 1.0 IF=6A VR=400V Tj=125C 10 0.8 0.6 IF S=[dIF/dt]/[dIR/dt] 0.4 VR(V) 1 1 10 100 1000 0.2 1 dIF/dt(A/s) 10 dIF/dt t 100 Fig. 9: Surge peak forward current versus number of cycles (per leg). IFSM(A) 180 160 tp=10ms 140 120 100 80 60 40 20 0 1 10 100 1000 Repetitive Tj initial=50C Non repetitive Tj initial=150C Number of cycles 3/4 STBR606/608 PACKAGE MECHANICAL DATA GBU DIMENSIONS REF. A J Millimeters Min. Max. 21.8 22.3 18.3 18.8 3.2 typ. 45 17.5 18 7.4 7.9 1.65 2.16 2.25 2.75 1.95 2.35 1.02 1.27 3.5 4.1 3.3 3.56 0.76 1 0.46 0.56 4.83 5.33 7 typ. 1.9 typ. 7 typ. Inches Min. Max. 0.86 0.88 0.72 0.74 0.125 typ. 45 0.69 0.71 0.29 0.31 0.065 0.085 0.089 0.108 0.077 0.093 0.04 0.05 0.14 0.16 0.13 0.14 0.03 0.04 0.018 0.022 0.19 0.21 7 typ. 0.075 typ. 7 typ. C E K O OQ B ~ ~ OP F + Front Side O L O G H D I M N N N A B C D E F G H I J K L M N O P Q Ordering type STBR606 STBR608 s Marking STBR606 STBR608 Package GBU GBU Weight 4.0g 4.0g Base qty 20 20 Delivery mode Tube Tube s s s Epoxy meets UL94,V0 Cooling method: C Recommended torque value: 0.8 m.N Maximum torque value: 1.0 m.N Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2001 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 4/4 |
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